A new method of nickel-gold plating uses chemicals rather than the more-commonly used electricity-based approach of passing electric current between a substrate and conductive solution. The new ...

If you haven’t considered ultrasonic machining for your thin and thick film ceramic substrate designs, you may be missing out on an opportunity to: Reduce your total solution cost Improve your ...

A multilayer technology developed by substrate manufacturer Lamina Ceramics (Westampton, NJ) enables unfired ceramic to be bonded to either Kovar or copper-molybdenum-copper (CuMoCu) metal. Offering ...