EDN

Ceramic-on-metal process improves thermal, electrical performance

A multilayer technology developed by substrate manufacturer Lamina Ceramics (Westampton, NJ) enables unfired ceramic to be bonded to either Kovar or copper-molybdenum-copper (CuMoCu) metal. Offering ...
Machine Design

Omega Micro Technologies Develops a Chemical Plating Process for Making Ceramic Substrates for Circuits

A new method of nickel-gold plating uses chemicals rather than the more-commonly used electricity-based approach of passing electric current between a substrate and conductive solution. The new ...
Business Wire

Shin-Etsu Chemical: Developing Equipment to Manufacture Semiconductor Package Substrates for the Back End Process and Pursuing a New Manufacturing Method

TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
TelecomTV

Hitachi Developed Ceramic Package Substrate to Enhance Data Processing Capability Ten Times Greater in Information Technology Equipment

Achieving high reliability and low cost package substrate compared with silicon interposer package Tokyo, December 11, 2015 --- Hitachi, Ltd. (TSE: 6501) and Hitachi Metals, Ltd. (TSE: 5486) have ...
Nanowerk

Successful integration and simplification of ceramic manufacturing process by using microwave

(Nanowerk News) In recent times, humans have faced the threats of global warming and depletion of energy resources. In Japan, about 40% of the greenhouse gases generated due to energy consumption are ...
Semiconductor Engineering

Embedded Die Packaging Emerges

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...