Amidst the rapid advancement in AI chip development, emerging technologies like chiplets are making semiconductor backend processes more intricate. As a result, the prices and profit potentials of ...

Rapidus has announced plans to establish a clean room at Seiko Epson's manufacturing facility in Chitose, Hokkaido, as well as a R&D center for semiconductor post-processing known as Rapidus Chiplet ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

TL;DR: Samsung Electronics has begun developing its next-generation 1nm process node, termed the "dream semiconductor process," requiring new technologies and High-NA EUV lithography. Mass production ...

The Busan Metropolitan Office of Education (Superintendent Kim Seokjun) has opened a semiconductor education center where both front-end and back-end semiconductor processes can be practiced, the ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

Sunfort™ dry film photoresist is a mainstay of Asahi Kasei’s Electronics business, comprising electronic materials and components. The entity is positioned as a First Priority business to drive growth ...

The DSP-100 integrates Nikon's high-resolution semiconductor lithography technology with the multi-lens technology* 4 from its flat panel display (FPD) lithography systems. It delivers high resolution ...

A research team has successfully developed a new technology that converts the conductivity properties of semiconductors with just one laser process. Subscribe to our newsletter for the latest sci-tech ...