EASI-Studio 3.0, part of the EASI-Tools family, offers designers automated solutions for packaging and deploying IP in a repeatable and reliable manner. EASI-Studio 3.0 provides the ability to capture ...
For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.
Eleco Software, the developer of professional 3D ArCon Architect Software, has appointed Sheffield-based Uber for the packaging design brief for its new products. Uber has been tasked with creating ...
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